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Expanding horizons in plasma technology at the Dry Processing Workshop 2024

Pradosh Kumar Sahoo, a laboratory assistant at the Micro and Nanodevices laboratory of ISSP UL, participated in the Dry Processing Workshop 2024 held on September 24-25 at the University of Stuttgart, Germany. Organized by Oxford Instruments, this workshop provided a platform for Sahoo to enhance his understanding of dry processing and plasma technology.

The event featured expert-led discussions on a range of topics, including etch processes for III/V and II/VI materials, dry etching of GaN devices, ion beam etching, and plasma processing of SiC. Participants engaged in hands-on experiences through lab tours and poster sessions, which showcased real-world applications of the technologies covered.

Networking opportunities were abundant, allowing attendees to connect with industry professionals, share ideas, and explore potential collaborations. Key topics such as atomic layer processing, endpoint detection techniques, quantum optics, and graphene growth were also discussed, equipping participants with the latest knowledge and best practices in plasma systems.

Sahoo found several lectures particularly insightful, especially those on deep silicon etching and MEMS, as well as the various Bosch processes. His interactions with engineers from Oxford Instruments and fellow participants were positive, significantly enhancing his grasp of dry processes, particularly the Bosch process for deep silicon etching. This experience is poised to benefit his work at the institute greatly.